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ESD Aluminum Foil Bags for Semiconductor Chip Packaging & Testing
July Thu , 2026
25

Packaging & testing is a critical process before IC delivery. Encapsulated bare dies, tested chips and semi-finished products are highly vulnerable to static electricity, dust and oxidation, which will cause pin oxidation, pad contamination and circuit failure, greatly reducing production yield. XCGS ESD aluminum foil bags are specially developed for strict clean-room & ESD control environments of semiconductor packaging and testing factories.

 

Made of high-purity aluminum composite film, the bags integrate ESD protection, EMI shielding, moisture & dust resistance and anti-oxidation functions. It blocks electromagnetic interference from workshop equipment to prevent chip parameter shift. No impurity precipitation during production, protecting delicate chip pins and pads from damage. Suitable for chip circulation, semi-finished storage and finished product temporary packaging in packaging & testing workshops. Compliant with packaging standards of leading OSATs including JCET and TFME, significantly improving chip yield rate.


Contact us: xcbwl@xcgs.com  or call me 0086 189 1555 0561 

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Company Add: Star Industrial Park , NO.666, Puzhuang AVE, Puzhuang Town ，Suzhou City，Jiangsu Province ,China
USA office: 3452 E FOOTHILL BLVD SUITE 120 PASADENA CA 9110
Hotline: +1 8606340384
E-mail: xcbwl@xcgs.com
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Founded in 1999, XCGS has always been in the forefront of research, manufacturing flexible packagings, we have mastered the core technology of industrial packaging and full degra-dation packaging manufacturing.
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