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ESD Aluminum Foil Bags for IC & Semiconductor Components
July Fri , 2026
24

ICs and SMT semiconductor components are miniature high-integration devices with ultra-low voltage tolerance. Friction static, humid air and external electromagnetic radiation during transit will cause latent damage or short-circuit failure, raising scrap loss severely. XCGS ESD aluminum foil bags are tailor-made for long-distance logistics and cross-region transit of semiconductor parts, solving the industry-wide problem of transport damage.

 

As a professional ESD packaging manufacturer, we optimize film structure for semiconductor shipment. Custom bags feature high toughness, superior puncture resistance and high durability. Vacuum sealing fully blocks oxygen and moisture to prevent IC oxidation. Stable static dissipation eliminates static buildup and circuit breakdown risks. Available in heat-seal and zip-lock styles, ideal for bulk component packing or single-chip individual packaging. Widely applied to long-distance & cross-border circulation of Logic ICs, Memory ICs and Analog ICs, minimizing transport scrap rate effectively.


Contact us: xcbwl@xcgs.com  or call me 0086 189 1555 0561 

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E-mail: contact@xcgs.com

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Company Add: Star Industrial Park , NO.666, Puzhuang AVE, Puzhuang Town ，Suzhou City，Jiangsu Province ,China
USA office: 3452 E FOOTHILL BLVD SUITE 120 PASADENA CA 9110
Hotline: +1 8606340384
E-mail: xcbwl@xcgs.com
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Founded in 1999, XCGS has always been in the forefront of research, manufacturing flexible packagings, we have mastered the core technology of industrial packaging and full degra-dation packaging manufacturing.
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