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ESD Aluminum Foil Bags for High-Precision Semiconductor
July Tue , 2026
13

With the widespread application of 5nm/7nm advanced process chips, HBM stacked chips and high-end sensor semiconductors, general packaging can no longer meet ultra-high-precision protection requirements.

 

Compliant with SEMI international standards, XCGS provide full-custom ESD vacuum aluminum foil bags with customized size, thickness and protection grade for advanced process and ultra-precision semiconductor devices. Manufactured in dust-free & sterile workshops with zero particle shedding and no chemical precipitation, the bags feature upgraded ESD protection, EMI shielding, moisture resistance and oxidation resistance. The vacuum sealing design isolates external contamination and ensures stable device performance. Support sample customization, bulk customization and printed logo customization, perfectly suitable for R&D sampling, pilot production and high-end shipment of high-end semiconductors.


 Contact Us For Expert Packaging Solutions Tailored To Your Needs!
📞 0086 18915550561   Email: xcbwl@xcgs.com


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Hotline: 001-213-650-9502
E-mail: contact@xcgs.com

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Company Add: Star Industrial Park , NO.666, Puzhuang AVE, Puzhuang Town ，Suzhou City，Jiangsu Province ,China
USA office: 3452 E FOOTHILL BLVD SUITE 120 PASADENA CA 9110
Hotline: +1 8606340384
E-mail: xcbwl@xcgs.com
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Founded in 1999, XCGS has always been in the forefront of research, manufacturing flexible packagings, we have mastered the core technology of industrial packaging and full degra-dation packaging manufacturing.
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