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Application of Anti-Static Shielding Bags in Semiconductor & Chip Industry
September Wed , 2026
19

The semiconductor industry is one of the sectors with the largest demand and the strictest protection standards for anti-static shielding bags. Precision components such as wafers, BGA & QFP SMD ICs, memory chips, tape-and-reel carrier tapes, and semi-finished packaging & testing products are extremely vulnerable to breakdown induced by tiny static electricity, which causes latent defects and massive scrapping losses for manufacturers. Professional ESD shielding packaging serves as an essential supporting solution throughout the whole industrial chain, covering in-process circulation and semi-finished product storage in Class 100 / Class 1000 clean-rooms, long-distance cross-border ocean shipment, and logistics delivery for after-sales rework.

 

Founded in 1999, Suzhou Star New Materials Group Co., Ltd. has focused on anti-static packaging for over 20 years. With six intelligent manufacturing bases located in Suzhou, Vietnam and other regions, we supply high-grade anti-static shielding bags that meet the cleanliness requirements for semiconductor clean-room environments. Our products adopt self-developed formulas and multi-layer lamination technology to form a Faraday shielding layer, which effectively blocks external high-voltage electrostatic field interference and dissipates static charges generated by friction during handling and transportation. The high-barrier film structure works perfectly with vacuum sealing and desiccants for MSL moisture-sensitive chips, delivering reliable long-term moisture-proof and anti-oxidation performance.

 

Our group owns a modern intelligent factory covering over 200,000 square meters and holds more than 100 independent R&D patents. We guarantee stable mass production and support customized specifications in dimensions, materials and printing. We have long-term partnerships with many leading wafer fabrication and IC packaging & testing enterprises. Backed by our rigorous quality control system, we have established stable strategic cooperation with more than 50 Fortune Global 500 companies worldwide. Relying on our global service network with overseas offices in the United States and Singapore, XCGS can deliver custom chip-specific shielding packages to ports in over 100 countries, providing a one-stop total packaging solution for domestic workshop turnover and overseas cross-border export of semiconductor products.


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Hotline: 001-213-650-9502
E-mail: contact@xcgs.com

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Company Add: Star Industrial Park , NO.666, Puzhuang AVE, Puzhuang Town ，Suzhou City，Jiangsu Province ,China
USA office: 3452 E FOOTHILL BLVD SUITE 120 PASADENA CA 9110
Hotline: 86 18915550561
E-mail: xcbwl@xcgs.com
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Founded in 1999, XCGS has always been in the forefront of research, manufacturing flexible packagings, we have mastered the core technology of industrial packaging and full degra-dation packaging manufacturing.
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